Blog: Hilscher Embedded Modules: Market Leader for more than a Quarter of a Century
2003 - Expansion of the protocol range
With the expansion in the industrial automation market, customers have placed more and more requirements on the COM module over time, which has resulted in Hilscher constantly adapting it. On the one hand, the form factor of the module has more than halved, the data width doubled and set to low-loss 3.3 V components. With the advent of further fieldbus technologies, such as DeviceNet and CANopen, Hilscher also recognized the chance to equip its COM modules with all industrial protocols quite early on.
The first multiprotocol-capable embedded module was born.
COM-AS
With only 10 mm, the COM-AS set the focus on a minimum component height.
It is used for parallel mounting below a front panel with vertical fieldbus connector/LEDs/switch.
Allows the installation of an industrial communication interface even in very flat devices.
COM-BA and COM-BN
The COM-BA, on the other hand, focuses on a minimum front width of 40 mm when mounted at right angles behind a front panel with angled fieldbus connector/LEDs.
As a COM-BN variant, the signals for the fieldbus/LEDs/switches are also routed to the host board, which results in additional space savings and greater flexibility during installation.
Allows the installation of an industrial communication interface even in very slim devices.
COM-CA and COM-CN
In the COM-CA and COM-CN, the focus was on a minimum module size (LxWxH): 30x70x1.5 mm.
Equally, 2.5 mm of free space is provided below the module for SMD components on the host board.
All connectors are placed on the outer edge, which saves space on the host board.
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Embedded modules from Hilscher are the ideal solution for integrating a fieldbus or Real-Time Ethernet interface into a compact automation device. They allow field devices such as drives or controllers to be quickly and easily integrated into automated systems.
The future prospects for the semiconductor industry are quite positive, with a projected growth of around 9% in 2022. However, the industry is repeatedly faced with supply bottlenecks due to the effects of the ongoing coronavirus pandemic, amongst other factors. By developing a new comX communication module, especially suited for the semiconductor industry, Hilscher is supporting to cope with the current situation.
The comX communication module was developed to equip automation devices with a network interface. Here, all communication tasks are executed autarchically on the module - independent of the target platform processor.